Development of Comprehensive in-line Quality Control System for Printed Circuit Board Assemblies / MICROSCAN

Project code: COOP-CT-2003-508616
ES programme: Framework Programe 6 (FP6)

Project flyer

The objective of the project

To develop the total quality control of printed circuit board (PCB) assemblies based on various non-destructive techniques: X-ray, infrared and acoustic techniques

Ultrasound institute

Has developed an improved ultrasonic imaging technique for examination of defects in PCB assemblies and electronic chips.

Project partners

X-Tek Systems Ltd (UK), Lot Oriel GmbH & CoKG (Germany), Machine Vision Products Inc. (UK), Gentech Electronics Ltd (Ireland), Beta Electronics Ltd (Ireland), Ultrasonics Sciences Ltd (UK), Inboard Leiterplattentechnologie GmbH (Germany), Goodrich Control Systems Ltd (UK), Fraunhofer-Gesselschaft zur Foerderungder AngewandtenForschung E.V. (Germany), TWI (UK), Kaunas University of Technology (Lithuania).

Related information

1. O. Tumšys, L. Mažeika, R. Kažys, R. Raišutis. Application of the signal processing in the case of ultrasonic inspection of PCB components. Ultragarsas. 2007. Vol. 62. No. 3. P. 16-19. /pdf/
2. R. Raišutis, O. Tumšys, R. Kažys and L. Mažeika. Application of ultrasonic iterative deconvolution technique to the case of internal defect detection in multi-layered PCB components. Insight. 2010. Vol. 52. No. 1. p. 27-33. /pdf/

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